So since I'm doing a bit more with making my own PCBs these days, I thought I'd start up a thread!
For myself, I'm using KiCAD for design, and JLCPCB for making them.
My current project is to take a ESP32 and get a board with a 3.3v LDO and wide range of inputs (e.g. 4.5-20v) so I don't have to worry about trying to solder to the castellated edges, and can fit it into smaller places than a full board with USB->Serial/etc all embedded. And without the full 0.1" pin spacing, so more compact. Going to use it for locations that are space constrained for WLED usage.
Future might be creating my own Buck or Boost or Buck/Boost onboad for a custom form-factor for width constrained spaces. But that's the future, seemed like significantly more...challenging to do safely.
Except I'm realizing that getting an ESP32 put onto it is far more expensive (relatively) than I realized. It needs Standard rather than the cheaper Economic, and ESP32 apparently is recommended doing baking (reduce risk of moisture with solder reflow process).
So now I need to rethink that. I might redesign the board to avoid any solder through-holes on the side, and instead bring out most of the GPIO into a grid, and that way I can make it even slimmer, and not bring some of the pins out and available, to help with size. And not get the ESP32 put on, just be careful with a small soldering tip, high temp, and I think I can make it work. Unfortunately means I won't get proper soldering for the pad on the underside of the ESP32 to the bottom/GND plane to help with temperature control. Most likely fine for this application though.
Future, I really want to be able to charge (4s2p LiIon) from USB-PD source, so 5-12v with boost, or 18-20v with buck with CC/CV to charge the battery. Seems like there are chips out there, but...serious design work.
EDIT: Wait...the 0201 sized LED wants to be baked? Not the ESP32? Huh. No, I'll accept the risk to do it without baking.
For myself, I'm using KiCAD for design, and JLCPCB for making them.
My current project is to take a ESP32 and get a board with a 3.3v LDO and wide range of inputs (e.g. 4.5-20v) so I don't have to worry about trying to solder to the castellated edges, and can fit it into smaller places than a full board with USB->Serial/etc all embedded. And without the full 0.1" pin spacing, so more compact. Going to use it for locations that are space constrained for WLED usage.
Future might be creating my own Buck or Boost or Buck/Boost onboad for a custom form-factor for width constrained spaces. But that's the future, seemed like significantly more...challenging to do safely.
Except I'm realizing that getting an ESP32 put onto it is far more expensive (relatively) than I realized. It needs Standard rather than the cheaper Economic, and ESP32 apparently is recommended doing baking (reduce risk of moisture with solder reflow process).
So now I need to rethink that. I might redesign the board to avoid any solder through-holes on the side, and instead bring out most of the GPIO into a grid, and that way I can make it even slimmer, and not bring some of the pins out and available, to help with size. And not get the ESP32 put on, just be careful with a small soldering tip, high temp, and I think I can make it work. Unfortunately means I won't get proper soldering for the pad on the underside of the ESP32 to the bottom/GND plane to help with temperature control. Most likely fine for this application though.
Future, I really want to be able to charge (4s2p LiIon) from USB-PD source, so 5-12v with boost, or 18-20v with buck with CC/CV to charge the battery. Seems like there are chips out there, but...serious design work.
EDIT: Wait...the 0201 sized LED wants to be baked? Not the ESP32? Huh. No, I'll accept the risk to do it without baking.
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